Technology Software

Packaging Specs

    Through-Hole Device Packages

    • Through-hole devices fit into an open slot or socket. A CQUAD, or ceramic quadruple side, has 52 leads or connectors and has a footprint measuring 16.26 square inches. A SIP, or single inline package, has 30 leads and a maximum footprint of 3.105 square inches. A transistor outline package, or TO, refers to the size of a single transistor. A TO may have three to eight leads and measure about 0.21 square inches.

    Dual In-line Packages

    • A DIP, or dual in-line package, has several variants: the CDIP or ceramic DIP; the HDIP or hermetic DIP, also known as Sidebraze Ceramic DIP or SBDIP; and PDIP or plastic DIP. All DIP variant packages have between eight and 40 pins and a maximum footprint of 33.5 square inches.

    Pin Grid Array

    • PGA, or pin grid array, has three variants: CPGA or ceramic PGA, PPGA or plastic PGA, and SPGA or staggered PGA. All PGA packages have between 68 and 387 pins and a maximum footprint of 2.67 square inches.

    Surface Mount Device Packages

    • Another major category of circuitry is surface-mounting devices. These circuits are mounted directly atop other components. SOICs, or small outline integrated circuits, have eight to 28 leads and a maximum footprint of 9.25 square inches.

    Ball Grid Array

    • BGA, or ball grid array, is a category of surface-mounting device that includes these varieties: ceramic BGA or CBGA, fine pitch BGA or FPBGA, plastic BGA or PBGA, and micro-BGA or mBGA. BGA package varieties have between 196 and 544 leads and a maximum footprint of 1.39 square inches.

    Leadless Chip Carriers

    • A leadless chip carrier, or LCC, is another category of surface-mounting package types; varieties include ceramic LCC or CLCC and plastic LCC or PLCC. LCCs have 18 to 68 leads and a maximum footprint of 0.96 inch.

    Leaded Chip Carriers

    • Leaded chip carriers are known by the same abbreviation as leadless chip carriers, LCC. The three types of leaded chip carriers are J-LCC, CLCC or ceramic LCC, and PLCC or plastic LCC. LCCs have 28 to 84 leads and a maximum footprint of 1.195 square inches.

    Quad Flat Pack

    • QFP, or quad flat pack, is another kind of surface-mounted package. There are six types of QFP: ceramic QFP or CQFP, plastic QFP or PQFP, QFP with a J-lead or QFJ, small QFP or SQFP, thin QFP or TQFP, and very thin QFP or VQFP. QFP packages have between 44 and 208 leads and a maximum footprint of 1.49 square inches.

    Small Outline Package

    • SOP, or small outline package, is another variety of surface-mounting package. SOP types include mini-SOP or MSOP, plastic SOP or PSOP, quarter-sized SOP or QSOP, small outline package with J-lead or SOJ, shrink SOP or SSOP, thin SOP or TSOP, thin shrink SOP or TSSOP, and thin very SOP or TVSOP. SOP circuits have 32 to 56 leads and a maximum footprint of 0.795 square inches.

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